Saturday, December 22, 2018

IBM, Samsung Ink Agreement to Build Future Power Chips


IBM and Samsung have signed a deal for Samsung to build Power chips on its 7nm process.

The post IBM, Samsung Ink Agreement to Build Future Power Chips appeared first on ExtremeTech.



from ExtremeTechExtremeTech http://bit.ly/2GzC59l

No comments:

Post a Comment

Cooper Rush and 2 Cowboys teammates to blame for blowout loss to the Texans - The Landry Hat

Cooper Rush and 2 Cowboys teammates to blame for blowout loss to the Texans    The Landry Hat Mixon, Texans' defense too much for Cowb...